# Intel on Getting Its Mojo Back

- Show: [EE Times Current](https://hardwarepodcasts.com/podcast/ee-times-current)
- Published: 2021-07-30
- Length: 29m
- Page: https://hardwarepodcasts.com/podcast/ee-times-current/2021-07-30-intel-on-getting-its-mojo-back
- Listen: https://www.eetimes.com/podcasts/eetoa-wb-ep146/

## Summary

Intel SVP Sanjay Natarajan explains the company's IDM 2.0 strategy and detailed technology roadmap, aiming to regain manufacturing leadership by 2025 through innovations like RibbonFET and PowerVia. He highlights Intel Foundry Services (IFS) partnerships with AWS and Qualcomm, emphasizing Intel's unique 'one-stop-shop' capability combining process, packaging, and software. Natarajan details how backside power delivery (PowerVia) and High-NA EUV lithography will improve power efficiency and density, targeting parity with TSMC and Samsung by 2024 and leadership by 2025.

## Chapters

- [0:00](https://hardwarepodcasts.com/podcast/ee-times-current/2021-07-30-intel-on-getting-its-mojo-back#t=0) Introduction: Geopolitics and Intel's Roadmap
- [2:22](https://hardwarepodcasts.com/podcast/ee-times-current/2021-07-30-intel-on-getting-its-mojo-back#t=142) IDM 2.0 and Technology Roadmap Overview
- [9:10](https://hardwarepodcasts.com/podcast/ee-times-current/2021-07-30-intel-on-getting-its-mojo-back#t=550) Customer Criteria and IFS Partnerships
- [14:20](https://hardwarepodcasts.com/podcast/ee-times-current/2021-07-30-intel-on-getting-its-mojo-back#t=860) RibbonFET and Innovation Track Record
- [17:59](https://hardwarepodcasts.com/podcast/ee-times-current/2021-07-30-intel-on-getting-its-mojo-back#t=1079) Execution Strategy and Incremental Nodes
- [20:23](https://hardwarepodcasts.com/podcast/ee-times-current/2021-07-30-intel-on-getting-its-mojo-back#t=1223) PowerVia Backside Power Delivery
- [24:08](https://hardwarepodcasts.com/podcast/ee-times-current/2021-07-30-intel-on-getting-its-mojo-back#t=1448) High-NA EUV Lithography and ASML

## Topics

- [PCB design & layout](https://hardwarepodcasts.com/topic/pcb-design)
- [Chips, FPGAs & semiconductors](https://hardwarepodcasts.com/topic/chips-and-fpgas)
- [Manufacturing partners & offshoring](https://hardwarepodcasts.com/topic/manufacturing-partners)
- [Scaling production](https://hardwarepodcasts.com/topic/scaling-production)

## Most relevant to

large enterprises

## Mentioned

- Intel (company)
- TSMC (company)
- Samsung (company)
- Sanjay Natarajan (other)
- RibbonFET (product)
- PowerVia (product)
- Foveros (product)
- EMIB (product)
- Intel Foundry Services (product)
- AWS (company)
- Qualcomm (company)
- ASML (company)
- Applied Materials (company)
- High-NA EUV (tool)

## Related episodes from other shows

- [Episode 35: The State of Intel via Their Innovation Summit](https://hardwarepodcasts.com/podcast/the-circuit/2023-09-25-episode-35-the-state-of-intel-via-their-innovation-summit) (The Circuit)
- [Season 5 of Moore's Lobby is Coming Soon](https://hardwarepodcasts.com/podcast/moores-lobby/2022-09-06-season-5-of-moores-lobby-is-coming-soon) (Moore's Lobby)
- [Episode 51: Intel Earnings and Foundry Trends](https://hardwarepodcasts.com/podcast/the-circuit/2024-01-29-episode-51-intel-earnings-and-foundry-trends) (The Circuit)
- [Episode 3: Moore's Law and Process vs. Packaging](https://hardwarepodcasts.com/podcast/the-circuit/2023-01-16-episode-3-moores-law-and-process-vs-packaging) (The Circuit)
- [Episode 116: Earnings (AAPL, QCOM), Intel's Chiplet Bet, AI Factory Thesis](https://hardwarepodcasts.com/podcast/the-circuit/2025-05-06-episode-116-earnings-aapl-qcom-intels-chiplet-bet-ai-factory-thesis) (The Circuit)

## Citing this page

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