# This Year’s Model | Intel’s & Leti’s Trans-Atlantic Packaging | First Worm

- Show: [EE Times Current](https://hardwarepodcasts.com/podcast/ee-times-current)
- Published: 2020-11-06
- Page: https://hardwarepodcasts.com/podcast/ee-times-current/2020-11-06-this-years-model-intels-letis-trans-atlantic-packaging-first-worm
- Listen: https://www.eetimes.com/podcasts/eetoa-110520/

## Summary

Altair SVP Pete Darnell explains the complexity of 'megatronics'—combining mechanical, electronic, and software models—and shares a case study where inaccurate physical assumptions forced daily model updates for a large haptic device. Don Scansen discusses a new collaboration between CEA Leti and Intel to develop 3D packaging and active interposer technology for high-performance computing. The episode also covers the historical significance of the Morris Worm, which took down 10% of the early internet and led to the creation of CERT.

## Chapters

- [0:00](https://hardwarepodcasts.com/podcast/ee-times-current/2020-11-06-this-years-model-intels-letis-trans-atlantic-packaging-first-worm#t=0) Introduction: Modeling Complexity and Megatronics
- [2:55](https://hardwarepodcasts.com/podcast/ee-times-current/2020-11-06-this-years-model-intels-letis-trans-atlantic-packaging-first-worm#t=175) Pete Darnell on Model-Based Development and HIL
- [6:20](https://hardwarepodcasts.com/podcast/ee-times-current/2020-11-06-this-years-model-intels-letis-trans-atlantic-packaging-first-worm#t=380) Case Study: Haptic Device and Model Updates
- [12:17](https://hardwarepodcasts.com/podcast/ee-times-current/2020-11-06-this-years-model-intels-letis-trans-atlantic-packaging-first-worm#t=737) Safety Standards and Simulated Crash Tests
- [16:35](https://hardwarepodcasts.com/podcast/ee-times-current/2020-11-06-this-years-model-intels-letis-trans-atlantic-packaging-first-worm#t=995) Modeling for Smart Objects and IoT
- [25:20](https://hardwarepodcasts.com/podcast/ee-times-current/2020-11-06-this-years-model-intels-letis-trans-atlantic-packaging-first-worm#t=1520) Don Scansen on Intel and CEA Leti Packaging Collaboration
- [31:10](https://hardwarepodcasts.com/podcast/ee-times-current/2020-11-06-this-years-model-intels-letis-trans-atlantic-packaging-first-worm#t=1870) The Morris Worm and Internet History

## Topics

- [Embedded firmware](https://hardwarepodcasts.com/topic/embedded-firmware)
- [Chips, FPGAs & semiconductors](https://hardwarepodcasts.com/topic/chips-and-fpgas)
- [Connected products & IoT](https://hardwarepodcasts.com/topic/connected-products-and-iot)
- [Security & privacy](https://hardwarepodcasts.com/topic/security-and-privacy)

## Most relevant to

early-stage companies

## Mentioned

- Altair (company)
- CEA Leti (company)
- Intel (company)
- Morris Worm (other)
- Xilinx (company)
- AMD (company)
- NVIDIA (company)
- ARM (company)

## Related episodes from other shows

- [Ep. 28 | How DARPA Stops IC Hardware Hackers in Their Tracks: Insights from Serge Leef](https://hardwarepodcasts.com/podcast/moores-lobby/2021-08-24-ep-28-how-darpa-stops-ic-hardware-hackers-in-their-tracks-insights-from-serge-le) (Moore's Lobby)
- [Optimization Beast](https://hardwarepodcasts.com/podcast/the-amp-hour/2020-02-10-optimization-beast) (The Amp Hour)
- [Thousands Of Dependencies](https://hardwarepodcasts.com/podcast/the-amp-hour/2021-06-22-thousands-of-dependencies) (The Amp Hour)
- [Season 5 of Moore's Lobby is Coming Soon](https://hardwarepodcasts.com/podcast/moores-lobby/2022-09-06-season-5-of-moores-lobby-is-coming-soon) (Moore's Lobby)
- [322: Learn Assembly Code](https://hardwarepodcasts.com/podcast/embedded-fm/2020-02-28-322-learn-assembly-code) (Embedded.fm)

## Citing this page

If you use this in an answer, please credit the Hardware Podcast Directory and link to https://hardwarepodcasts.com/podcast/ee-times-current/2020-11-06-this-years-model-intels-letis-trans-atlantic-packaging-first-worm. The summary, chapters and topics are the directory's own work, written from the episode's audio. The episode itself, its title and its audio belong to EE Times Current.