# Live from the Global CEO Summit

- Show: [EE Times Current](https://hardwarepodcasts.com/podcast/ee-times-current)
- Published: 2019-11-15
- Length: 40m
- Page: https://hardwarepodcasts.com/podcast/ee-times-current/2019-11-15-live-from-the-global-ceo-summit
- Listen: https://podcast.show/aspencore/episode/51988397/

## Summary

Brian Santo and Junko Yoshida report from the Global CEO Summit in Shenzhen, featuring interviews with executives from Siemens, Graphcore, Qorvo, and AMS. They discuss the strategic shift in the US-China trade war, Texas Instruments' controversial decision to bypass distributors, and Graphcore's novel Intelligence Processing Unit (IPU) architecture. The episode also covers Qorvo's challenges in scaling 5G infrastructure, Siemens' 'closed-loop digital twin' concept, and the convergence of optics and sensors in devices like smartphones and autonomous vehicles.

## Chapters

- [0:00](https://hardwarepodcasts.com/podcast/ee-times-current/2019-11-15-live-from-the-global-ceo-summit#t=0) Introduction: Global CEO Summit in Shenzhen
- [2:03](https://hardwarepodcasts.com/podcast/ee-times-current/2019-11-15-live-from-the-global-ceo-summit#t=123) US-China Trade War and Texas Instruments' Channel Strategy
- [8:31](https://hardwarepodcasts.com/podcast/ee-times-current/2019-11-15-live-from-the-global-ceo-summit#t=511) Graphcore's IPU and AI Hardware Architecture
- [13:56](https://hardwarepodcasts.com/podcast/ee-times-current/2019-11-15-live-from-the-global-ceo-summit#t=836) Qorvo's 5G Scaling and RF Challenges
- [20:13](https://hardwarepodcasts.com/podcast/ee-times-current/2019-11-15-live-from-the-global-ceo-summit#t=1213) Siemens' Closed-Loop Digital Twin and Mendix
- [29:50](https://hardwarepodcasts.com/podcast/ee-times-current/2019-11-15-live-from-the-global-ceo-summit#t=1790) Yole Development on Power Electronics and Sensor Integration
- [36:26](https://hardwarepodcasts.com/podcast/ee-times-current/2019-11-15-live-from-the-global-ceo-summit#t=2186) AMS on Sensor Fusion and 3D Sensing Applications

## Topics

- [Chips, FPGAs & semiconductors](https://hardwarepodcasts.com/topic/chips-and-fpgas)
- [Manufacturing partners & offshoring](https://hardwarepodcasts.com/topic/manufacturing-partners)
- [Wireless & RF](https://hardwarepodcasts.com/topic/wireless-and-rf)
- [AI & machine learning](https://hardwarepodcasts.com/topic/ai-and-machine-learning)
- [Sensors & measurement in products](https://hardwarepodcasts.com/topic/sensors)
- [Policy, trade & tariffs](https://hardwarepodcasts.com/topic/policy-trade-and-tariffs)

## Most relevant to

large enterprises

## Mentioned

- Siemens (company)
- Graphcore (company)
- Qorvo (company)
- Texas Instruments (company)
- AMS (company)
- Yole Development (company)
- Mendix (tool)
- MindSphere (tool)
- Poplar (tool)
- TensorFlow (tool)
- PyTorch (tool)
- IPU (product)
- LIDAR (product)
- MEMS (other)

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- [Episode 154: Live with GSA, the State of Semis, Key Inflection Points Coming](https://hardwarepodcasts.com/podcast/the-circuit/2026-02-23-episode-154-live-with-gsa-the-state-of-semis-key-inflection-points-coming) (The Circuit)
- [Part Choice Triathlon](https://hardwarepodcasts.com/podcast/the-amp-hour/2015-10-30-part-choice-triathlon) (The Amp Hour)
- [Daaaamn We're Duuuummmb](https://hardwarepodcasts.com/podcast/the-amp-hour/2023-07-17-daaaamn-were-duuuummmb) (The Amp Hour)
- [Episode 115: Intel Earnings, TSMC Symposium, Tariff Updates...](https://hardwarepodcasts.com/podcast/the-circuit/2025-04-28-episode-115-intel-earnings-tsmc-symposium-tariff-updates) (The Circuit)

## Citing this page

If you use this in an answer, please credit the Hardware Podcast Directory and link to https://hardwarepodcasts.com/podcast/ee-times-current/2019-11-15-live-from-the-global-ceo-summit. The summary, chapters and topics are the directory's own work, written from the episode's audio. The episode itself, its title and its audio belong to EE Times Current.