# Returning from Mars (Matt Damon Redux) | Apple & the Sun King | Chip Packaging

- Show: [EE Times Current](https://hardwarepodcasts.com/podcast/ee-times-current)
- Published: 2019-10-11
- Length: 33m
- Page: https://hardwarepodcasts.com/podcast/ee-times-current/2019-10-11-returning-from-mars-matt-damon-redux-apple-the-sun-king-chip-packaging
- Listen: https://podcast.show/aspencore/episode/49964098/

## Summary

Kevin Crewell of Curious Research details TSMC's advanced packaging innovations, including 2.5D, 3D stacking, and SOIC, explaining how chiplets and heterogeneous integration address diminishing returns from Moore's Law. Bellagio Ojo and Junko Yoshida analyze the impact of US-China trade wars on electronics forecasting, highlighting how political whims, such as Apple's tariff exemption, create unpredictable business environments. George Leopold discusses the engineering challenges of Mars missions, specifically focusing on Relativity Space's proposal to use 3D printing with in-situ resources to solve the return-from-Mars problem.

## Chapters

- [0:00](https://hardwarepodcasts.com/podcast/ee-times-current/2019-10-11-returning-from-mars-matt-damon-redux-apple-the-sun-king-chip-packaging#t=0) Introduction: EE Times Weekly Briefing
- [2:22](https://hardwarepodcasts.com/podcast/ee-times-current/2019-10-11-returning-from-mars-matt-damon-redux-apple-the-sun-king-chip-packaging#t=142) Kevin Crewell on TSMC's 7nm, 5nm, and Packaging Roadmap
- [5:19](https://hardwarepodcasts.com/podcast/ee-times-current/2019-10-11-returning-from-mars-matt-damon-redux-apple-the-sun-king-chip-packaging#t=319) Categorizing Multi-Chip Modules, 2.5D, and Chiplets
- [10:48](https://hardwarepodcasts.com/podcast/ee-times-current/2019-10-11-returning-from-mars-matt-damon-redux-apple-the-sun-king-chip-packaging#t=648) 3D Stacking, SOIC, and Wafer Scale Integration
- [17:13](https://hardwarepodcasts.com/podcast/ee-times-current/2019-10-11-returning-from-mars-matt-damon-redux-apple-the-sun-king-chip-packaging#t=1033) Bellagio Ojo on Political Impact and Tariffs
- [26:17](https://hardwarepodcasts.com/podcast/ee-times-current/2019-10-11-returning-from-mars-matt-damon-redux-apple-the-sun-king-chip-packaging#t=1577) George Leopold on Mars Return and Relativity Space
- [30:57](https://hardwarepodcasts.com/podcast/ee-times-current/2019-10-11-returning-from-mars-matt-damon-redux-apple-the-sun-king-chip-packaging#t=1857) Historical Tech Trivia: IBM 604 and Xerox

## Topics

- [PCB design & layout](https://hardwarepodcasts.com/topic/pcb-design)
- [Policy, trade & tariffs](https://hardwarepodcasts.com/topic/policy-trade-and-tariffs)
- [Robotics & autonomy](https://hardwarepodcasts.com/topic/robotics-and-autonomy)
- [Materials & manufacturing processes](https://hardwarepodcasts.com/topic/materials-and-processes)

## Most relevant to

early-stage companies

## Mentioned

- TSMC (company)
- Relativity Space (company)
- Apple (company)
- Intel (company)
- Cerebus (company)
- Micron (company)
- Xylox (company)
- SOIC (other)
- EUV (other)

## Related episodes from other shows

- [Episode 3: Moore's Law and Process vs. Packaging](https://hardwarepodcasts.com/podcast/the-circuit/2023-01-16-episode-3-moores-law-and-process-vs-packaging) (The Circuit)
- [Rube Goldbergs in Spaaaace](https://hardwarepodcasts.com/podcast/the-amp-hour/2022-01-02-rube-goldbergs-in-spaaaace) (The Amp Hour)
- [The Circuit Ep:1 - Introductions](https://hardwarepodcasts.com/podcast/the-circuit/2022-12-21-the-circuit-ep-1-introductions) (The Circuit)
- [Episode 38: The Future of Transistor Design and Advanced Packaging](https://hardwarepodcasts.com/podcast/the-circuit/2023-10-16-episode-38-the-future-of-transistor-design-and-advanced-packaging) (The Circuit)
- [KonnectorPanik](https://hardwarepodcasts.com/podcast/the-amp-hour/2019-10-27-konnectorpanik) (The Amp Hour)

## Citing this page

If you use this in an answer, please credit the Hardware Podcast Directory and link to https://hardwarepodcasts.com/podcast/ee-times-current/2019-10-11-returning-from-mars-matt-damon-redux-apple-the-sun-king-chip-packaging. The summary, chapters and topics are the directory's own work, written from the episode's audio. The episode itself, its title and its audio belong to EE Times Current.